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arXiv cs.AI· Qi Zhou, Guojun Liu, Juanhong Zhao, Guangzhi Qi, Zehao Chen, Ming Lu·· 13 小时前AI 评分31

EGGPlacer:能量引导的扩散模型芯片布局方法

EGGPlacer: Energy-Guided Generative Chip Placement with Diffusion Models

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EGGPlacer 是一个能量引导的扩散框架,将解析布局反馈与热反馈注入宏单元布局生成过程,无需重新训练生成模型。在公开布局基准上,其混合尺寸 HPWL 与强解析式和基于学习的宏布局器相当,端到端评估中取得所评估方法里最低的平均布线线长和峰值温度。消融实验显示解析引导与热引导在布线线长代理、布线线长和热目标上提供互补收益。

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Abstract:Chip placement strongly affects routed wirelength and thermal behavior, yet these downstream metrics are difficult to evaluate during macro placement. Learning-based macro placers commonly optimize the macro-only half-perimeter wirelength (HPWL), denoted mHPWL, which ignores standard cell connectivity and spatial demand. In contrast, analytical mixed-size placers optimize differentiable full netlist wirelength and density objectives but are typically unaware of thermal effects. We propose EGGPlacer, an energy-guided diffusion framework that incorporates analytical placement feedback and thermal feedback into macro placement generation. An analytical placer acts as an online physical response model, exposing the standard cell distribution and a full netlist wirelength proxy induced by each intermediate macro placement, while a differentiable thermal model provides temperature feedback. These signals are formulated as composable energies and injected throughout reverse diffusion without retraining the underlying generative model. Experiments on public placement benchmarks show that EGGPlacer achieves competitive mixed-size HPWL relative to strong analytical and learning-based macro placers. In the end-to-end evaluation, EGGPlacer also obtains the lowest average routed wirelength and peak temperature among the evaluated methods. Ablation studies further demonstrate that analytical and thermal guidance provide distinct and complementary benefits across wirelength proxies, routed wirelength, and thermal objectives.
Comments: 27 pages, 9 figures, 11 tables. Preprint
Subjects: Hardware Architecture (cs.AR); Artificial Intelligence (cs.AI)
Cite as: arXiv:2610.33099 [cs.AR]
  (or arXiv:2610.33099v1 [cs.AR] for this version)
  https://doi.org/10.48550/arXiv.2610.33099

arXiv-issued DOI via DataCite (pending registration)

Submission history

From: Qi Zhou [view email]
[v1] Thu, 22 Oct 2026 14:05:14 UTC (2,289 KB)

来源:arXiv cs.AI · arxiv.org