台积电 CoWoS 封装据报再涨价最高 20%

Rohan Paul· @rohanpaul_ai · X·2026-10-27 07:35· 1 小时前AI 评分47

AI 导读

台积电据报正筹备新一轮 CoWoS 封装涨价，幅度最高 20%，因 AI 封装需求超过供给。需求已从 GPU 扩散到服务器 CPU 和定制 ASIC，代工与封装厂商预计涨价 10% 至 20%。设备交期已从 3-6 个月拉长到 6-8 个月，且更大封装会降低单台设备每小时产出，进一步加剧产能紧张。

正文 · 原文

TSMC is reportedly preparing another CoWoS price rise of up to 20% as AI packaging demand outruns supply.

CoWoS (Chip on Wafer on Substrate), joins an AI processor to its high-bandwidth memory on one densely wired base.

Demand has spread from GPUs to server CPUs and custom ASICs, so foundries and packagers expect 10% to 20% increases.

Supply can’t jump quickly, since equipment lead times stretched from 3-6 months to 6-8 months, and tool buyers no longer haggle.

Larger packages will deepen the squeeze, because they cut each tool’s hourly output, so even flat chip volumes need more machines.

They keep growing: TSMC chairman C.C. Wei says packages 5 times the largest printable chip are in mass production at excellent yields, with 9x and 14x planned.

来源：Rohan Paul · x.com